- 专利标题: Module board coupling
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申请号: US16068094申请日: 2015-12-22
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公开(公告)号: US10534138B2公开(公告)日: 2020-01-14
- 发明人: Kevin B. Leigh , Sunil Ganta , John Norton , George D. Megason
- 申请人: Hewlett Packard Enterprise Development LP
- 申请人地址: US TX Houston
- 专利权人: Hewlett Packard Enterprise Development
- 当前专利权人: Hewlett Packard Enterprise Development
- 当前专利权人地址: US TX Houston
- 代理机构: Brooks, Cameron & Huebsch, PLLC
- 国际申请: PCT/US2015/067409 WO 20151222
- 国际公布: WO2017/111947 WO 20170629
- 主分类号: G02B6/36
- IPC分类号: G02B6/36 ; G02B6/42 ; H04B10/40
摘要:
In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.
公开/授权文献
- US20190018199A1 MODULE BOARD COUPLING 公开/授权日:2019-01-17
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