- 专利标题: Feedback device and method of providing thermal feedback using the same
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申请号: US15858351申请日: 2017-12-29
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公开(公告)号: US10533780B2公开(公告)日: 2020-01-14
- 发明人: Kyoung Soo Yi , Ock Kyun Oh , Se Hwan Lim
- 申请人: TEGway Co., Ltd.
- 申请人地址: KR Daejeon
- 专利权人: TEGWAY CO., LTD.
- 当前专利权人: TEGWAY CO., LTD.
- 当前专利权人地址: KR Daejeon
- 代理机构: Maschoff Brennan
- 优先权: KR10-2017-0111462 20170831; KR10-2017-0111463 20170831; KR10-2017-0111464 20170831; KR10-2017-0111465 20170831; KR10-2017-0111466 20170831; KR10-2017-0111467 20170831
- 主分类号: F25B21/04
- IPC分类号: F25B21/04 ; A41D1/00
摘要:
Disclosed herein are a feedback device and a method of providing thermal feedback using the same. The feedback device according to an embodiment of the present disclosure includes a thermoelectric module including a substrate having flexibility, a thermoelement disposed on the substrate and configured to perform a thermoelectric operation for thermal feedback, and a contact surface disposed on the substrate, and configured to transfer heat generated through the thermoelectric operation to a user through the substrate and the contact surface to output the thermal feedback; and a feedback controller configured to control the thermoelectric module, and wherein the feedback controller controls the thermoelectric module so that, after a temperature of the contact surface reaches a maximum temperature, the temperature of the contact surface is maintained within a predetermined temperature range during an entire thermoelectric operation time interval.
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