- 专利标题： Methods of packaging semiconductor devices and packaged semiconductor devices
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申请号： US16055294申请日： 2018-08-06
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公开(公告)号： US10510719B2公开(公告)日： 2019-12-17
- 发明人: Chen-Hua Yu , Chung-Shi Liu , Meng-Tse Chen , Hui-Min Huang , Chih-Fan Huang , Ming-Da Cheng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company
- 当前专利权人： Taiwan Semiconductor Manufacturing Company
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/31 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L21/3105 ; H01L21/683 ; H01L21/768 ; H01L21/78 ; H01L23/528 ; H01L23/58 ; H01L25/00 ; H01L21/56 ; H01L23/15
摘要：
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a dam structure on dies proximate edge regions of the dies. A molding material is disposed around the dies, and a top portion of the molding material and a top portion of the dam structure are removed.
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