- 专利标题： Wafer carrier assembly
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申请号： US15130108申请日： 2016-04-15
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公开(公告)号： US10510563B2公开(公告)日： 2019-12-17
- 发明人: Ming-Tung Wu , Hsun-Chung Kuang
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： WPAT, P.C., Intellectual Property Attorneys
- 代理商 Anthony King
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/687 ; B24B37/32
摘要：
A wafer carrier assembly includes a wafer carrier and a fluid passage. The wafer carrier comprises a retainer ring confining a wafer accommodation space. The fluid passage is inside the wafer carrier. The fluid passage includes an inlet and at least an outlet to dispense fluid into the wafer accommodation space.
公开/授权文献
- US20170301563A1 WAFER CARRIER ASSEMBLY 公开/授权日：2017-10-19
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