Invention Grant
- Patent Title: Vertical gate-all-around transistor and manufacturing method thereof
-
Application No.: US15727380Application Date: 2017-10-06
-
Publication No.: US10475744B2Publication Date: 2019-11-12
- Inventor: Kuan-Hung Chen , Rung-Yuan Lee , Chun-Tsen Lu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: CN201710800066 20170907
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L21/02 ; H01L21/762 ; H01L29/423 ; H01L29/06 ; B82Y99/00

Abstract:
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a substrate, an isolation structure, an outer structure, and a gate structure. The isolation structure is disposed on the substrate. The outer structure surrounds a sidewall of the isolation structure. The gate structure surrounds a central part of the outer structure, so that the central part covered by the gate structure becomes a channel region, and the outer structure at both sides of the central part respectively becomes a source region and a drain region.
Public/Granted literature
- US20190074250A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-03-07
Information query
IPC分类: