- 专利标题： Conductive pattern formation method and conductive pattern formation device
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申请号： US14739224申请日： 2015-06-15
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公开(公告)号： US10440831B2公开(公告)日： 2019-10-08
- 发明人: Dai Suwama , Sayaka Morita , Keita Saito , Midori Shimomura
- 申请人： Konica Minolta, Inc.
- 申请人地址： JP Chiyoda-Ku, Tokyo
- 专利权人： KONICA MINOLTA, INC.
- 当前专利权人： KONICA MINOLTA, INC.
- 当前专利权人地址： JP Chiyoda-Ku, Tokyo
- 代理机构： Buchanan Ingersoll & Rooney PC
- 优先权： JP2014-128722 20140624
- 主分类号： H05K3/12
- IPC分类号： H05K3/12
摘要：
A conductive pattern formation method includes: a step of patterning a base member with an ink in which conductive particulates are distributed to form a pattern; a step of making a conductive developer act on the pattern; and a pressurization step of pressurizing the pattern.
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