发明授权
- 专利标题: Flexible printed circuit and a method of fabricating a flexible printed circuit
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申请号: US14396964申请日: 2012-06-29
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公开(公告)号: US10420215B2公开(公告)日: 2019-09-17
- 发明人: Siang Sin Foo , Choong Meng How
- 申请人: Siang Sin Foo , Choong Meng How
- 申请人地址: US MN St. Paul
- 专利权人: 3M INNOVATIVE PROPERTIES COMPANY
- 当前专利权人: 3M INNOVATIVE PROPERTIES COMPANY
- 当前专利权人地址: US MN St. Paul
- 代理商 Clifton F. Richardson
- 国际申请: PCT/US2012/044855 WO 20120629
- 国际公布: WO2014/003779 WO 20140103
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K3/10 ; A61B5/0416 ; A61B5/0408 ; H05K3/38 ; H05K3/40
摘要:
Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.
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