Invention Grant
- Patent Title: System and method for self-contained subslot bundling
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Application No.: US15703867Application Date: 2017-09-13
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Publication No.: US10396962B2Publication Date: 2019-08-27
- Inventor: Chong Li , Junyi Li , Hao Xu , Jing Jiang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox LLP
- Main IPC: H04W72/04
- IPC: H04W72/04 ; H04L5/00 ; H04B7/06 ; H04L1/18

Abstract:
An apparatus may configure x subframes with a subslot configuration that includes y subslots, y being greater than x. In an aspect, each subslot of the y subslots may include a first portion having one or more symbols for carrying at least one of data or control information, a second portion having a gap, and a third portion for carrying ACK/NACK information associated with the first portion. In an aspect, the second portion may be between the first portion and the third portion. In an aspect, the second portion and the third portion may include at most one symbol. The apparatus may send information indicating the subslot configuration to at least one neighboring base station. The apparatus may communicate content with a user equipment (UE) during at least one of the y subslots.
Public/Granted literature
- US20180175989A1 SYSTEM AND METHOD FOR SELF-CONTAINED SUBSLOT BUNDLING Public/Granted day:2018-06-21
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