- 专利标题: 3D memory device and structure
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申请号: US15452615申请日: 2017-03-07
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公开(公告)号: US10388863B2公开(公告)日: 2019-08-20
- 发明人: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- 申请人: Monolithic 3D Inc.
- 申请人地址: US CA San Jose
- 专利权人: MONOLITHIC 3D INC.
- 当前专利权人: MONOLITHIC 3D INC.
- 当前专利权人地址: US CA San Jose
- 代理机构: Tran & Associates
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L21/762 ; H01L27/06 ; H01L27/11578 ; H01L27/24 ; H01L45/00
摘要:
A 3D integrated circuit device, including: a first transistor; a second transistor; and a third transistor, where the third transistor is overlaying the second transistor and is controlled by a third control line, where the second transistor is overlaying the first transistor and is controlled by a second control line, where the first transistor is part of a control circuit controlling the second control line and third control line, and where the first transistor, the second transistor and the third transistor are all aligned to each other with less than 100 nm misalignment.
公开/授权文献
- US20170179155A1 3D MEMORY DEVICE AND STRUCTURE 公开/授权日:2017-06-22
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