- 专利标题: Light emitting package
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申请号: US15863146申请日: 2018-01-05
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公开(公告)号: US10388841B2公开(公告)日: 2019-08-20
- 发明人: Byung Mok Kim , Hiroshi Kodaira , Su Jung Jung , Bo Hee Kang , Young Jin No , Yuichiro Tanda , Satoshi Ozeki
- 申请人: LG INNOTEK CO., LTD.
- 申请人地址: KR Seoul
- 专利权人: LG Innotek Co., Ltd.
- 当前专利权人: LG Innotek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: KED & Associates LLP
- 优先权: KR10-2012-0087167 20120809
- 主分类号: H01L33/58
- IPC分类号: H01L33/58 ; H01L33/64 ; H01L33/48
摘要:
A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
公开/授权文献
- US20180130934A1 LIGHT EMITTING PACKAGE 公开/授权日:2018-05-10
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