发明授权
- 专利标题: On-chip combined hot carrier injection and bias temperature instability monitor
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申请号: US15925989申请日: 2018-03-20
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公开(公告)号: US10388580B2公开(公告)日: 2019-08-20
- 发明人: Keith A. Jenkins , Barry Linder
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; G01R31/28 ; G01R31/26
摘要:
Methods and circuits for monitoring circuit degradation include measuring degradation in a set of on-chip test oscillators that vary according to a quantity that influences a first type of degradation. A second type of contribution to the measured degradation is determined by extrapolating from the measured degradation for the plurality of test oscillators. The second type of contribution is subtracted from the measured degradation at a predetermined value of the quantity to determine the first type of degradation for devices represented by the predetermined value.
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