- 专利标题： Solder fill into high aspect through holes
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申请号： US15068002申请日： 2016-03-11
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公开(公告)号： US10388566B2公开(公告)日： 2019-08-20
- 发明人: Toyohiro Aoki , Akihiro Horibe , Kuniaki Sueoka , Kazushige Toriyama
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L21/67 ; H01L21/687 ; B23K3/06 ; H01L21/48
摘要：
A method for filling a through hole with solder includes mounting a substrate having a through hole formed therein on a permeable barrier layer having pores that enable gas to flow through the permeable barrier. A solder source is positioned over the through hole. Molten solder is delivered in the through hole with a positive pressure from the solder source such that gas in the through holes passes the permeable barrier while the molten solder remains in the through hole.
公开/授权文献
- US20170263498A1 SOLDER FILL INTO HIGH ASPECT THROUGH HOLES 公开/授权日：2017-09-14
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