Invention Grant
- Patent Title: Laser machining systems and methods
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Application No.: US14599612Application Date: 2015-01-19
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Publication No.: US10357848B2Publication Date: 2019-07-23
- Inventor: Hongqiang Chen , Steven Robert Hayashi , Xi Zhang
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/04 ; B23K26/08 ; B23K26/38 ; B23K26/40 ; B23K103/00

Abstract:
A laser machining method includes directing, from an F-theta lens having a long focal length of greater than about 250 millimeters, a laser beam at a non-perpendicular beam tilt angle from an optical axis of the lens having a top-hat profile and a narrow beam divergence angle of between about 1 degree and about 3 degrees towards a workpiece on a stage movable in at least an X-direction and a Y-direction, engaging the directed laser beam with the workpiece disposed in the usable field of view, moving the workpiece and the directed laser beam relative to each other, and removing portions of the workpiece with the directed laser beam to define a machined surface.
Public/Granted literature
- US20160207143A1 LASER MACHINING SYSTEMS AND METHODS Public/Granted day:2016-07-21
Information query
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