A component mounting device which mounts on a board electronic components including a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting device includes a moving and mounting head which holds and takes out the fitting component by a holding unit from a component supply part to move and mount the fitting component on the to-be-attached part of the board, and a pressing head which presses the fitting component that is moved and mounted on the to-be-attached part by a pressing unit to attach the fitting component to the to-be-attached part.