Invention Grant
- Patent Title: Area-efficient connections to SIP modules
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Application No.: US15713453Application Date: 2017-09-22
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Publication No.: US10334732B2Publication Date: 2019-06-25
- Inventor: Lan H. Hoang , Takayoshi Katahira
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton, LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H05K1/18 ; H05K7/14 ; H05K1/11 ; H05K1/14
Abstract:
Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.
Public/Granted literature
- US20190098762A1 AREA-EFFICIENT CONNECTIONS TO SIP MODULES Public/Granted day:2019-03-28
Information query
