- 专利标题: Circuitry and method for readout of hybrid bonded image sensors
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申请号: US15979366申请日: 2018-05-14
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公开(公告)号: US10321078B2公开(公告)日: 2019-06-11
- 发明人: Song Xue
- 申请人: OmniVision Technologies, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: OmniVision Technologies, Inc.
- 当前专利权人: OmniVision Technologies, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Lathrop Gage LLP
- 主分类号: H04N5/374
- IPC分类号: H04N5/374 ; H04N5/357 ; H04N5/243 ; H04N5/3745 ; H01L27/146 ; H04N5/369
摘要:
A hybrid bonded image sensor has a photodiode die with macrocells having at least one photodiode and a bond contact; a supporting circuitry die with multiple supercells, each supercell having at least one macrocell unit bonded to the bond contact of a macrocell of the photodiode die. Each macrocell unit has a reset transistor adapted to reset photodiodes of the photodiode die macrocell. Each supercell has a differential amplifier configurable to receive a noninverting input from a photodiode and an inverting input, the differential amplifier providing an output, each differential amplifier has an amplifier reset transistor coupled to the differential amplifier output and the inverting input; a first capacitor coupled between the differential amplifier output and the inverting input, and a second capacitor coupled between the inverting input and a signal ground. The first and second capacitor of embodiments has controllable capacitance to adjust gain.
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