Invention Grant
- Patent Title: Apparatus utilizing computer on package construction
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Application No.: US14604531Application Date: 2015-01-23
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Publication No.: US10317938B2Publication Date: 2019-06-11
- Inventor: Eng Huat Goh , Khai Ern See , Damien Weng Kong Chong , Min Suet Lim , Ping Ping Ooi , Chu Aun Lim , Jimmy Huat Since Huang , Poh Tat Oh , Teong Keat Beh , Jackson Chung Peng Kong , Fern Nee Tan , Jenn Chuan Cheng
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K1/18 ; G06F1/18 ; G06F13/38

Abstract:
Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.
Public/Granted literature
- US20160216731A1 APPARATUS UTILIZING COMPUTER ON PACKAGE CONSTRUCTION Public/Granted day:2016-07-28
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