Invention Grant
- Patent Title: Laser processing method
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Application No.: US15763605Application Date: 2016-08-08
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Publication No.: US10290545B2Publication Date: 2019-05-14
- Inventor: Takafumi Ogiwara , Yuta Kondoh
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2015-191095 20150929
- International Application: PCT/JP2016/073355 WO 20160808
- International Announcement: WO2017/056739 WO 20170406
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B23K26/046 ; B23K26/53 ; H01L21/02 ; H01L21/268 ; H01L21/304 ; H01L21/683 ; H01L23/544 ; B23K103/00

Abstract:
Laser light is converged at an object including a semiconductor substrate formed with a plurality of functional devices on a front surface, from a back surface of the semiconductor substrate, and while a distance between the front surface and a first converging point of the laser light is maintained at a first distance, whereby a first modified region is formed along the line. The laser light is converged at the object from the back surface, and while a distance between the front surface and a second converging point is maintained at a second distance, and while the second converging point is offset with respect to a position at which the first converging point is converged, whereby a second modified region is formed along the line. A predetermined portion including the back surface and at least the second modified region is removed.
Public/Granted literature
- US20180294189A1 LASER PROCESSING METHOD Public/Granted day:2018-10-11
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