A manufacturing method of a package structure having an embedded bonding film comprises the following steps: forming a bonding film, forming a redistribution substrate and forming a core on a bottom side of the redistribution substrate opposite to the top side. The bonding film comprises the following steps: forming a plurality of dielectric layers and metal circuit layers sequentially and alternatively in a plurality of bonding areas; exposing a plurality of top metal pads of a topmost metal circuit layer among the metal circuit layers in the plurality of bonding areas; and etching to form a bonding film. The bonding film has a left longitudinal branch and a lower latitudinal branch. A lower end of the left longitudinal branch is connected to a left end of the lower latitudinal branch. The left longitudinal branch and the lower latitudinal branch form an L shape.