Invention Grant
- Patent Title: Thermal mechanical dimple array for a combustor wall assembly
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Application No.: US15105409Application Date: 2014-12-19
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Publication No.: US10281152B2Publication Date: 2019-05-07
- Inventor: Hoyt Y. Chang
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: O'Shea Getz P.C.
- International Application: PCT/US2014/071601 WO 20141219
- International Announcement: WO2015/095759 WO 20150625
- Main IPC: F02G3/00
- IPC: F02G3/00 ; F23R3/00 ; F23R3/50

Abstract:
A thermal mechanical dimple array for combustor liners of gas turbine engines are located at known hot spots along liner to reduce stress and minimize cracking. Such arrays have indentations in the liners at the hot spots that act to thermal mechanically flex the liner at the hot spot away from the heat source and distribute stresses such that cracking of the liner is reduced and durability is improved.
Public/Granted literature
- US20160320060A1 THERMAL MECHANICAL DIMPLE ARRAY FOR A COMBUSTOR WALL ASSEMBLY Public/Granted day:2016-11-03
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