Invention Grant
- Patent Title: Heat flow distribution measurement device
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Application No.: US15310839Application Date: 2015-06-01
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Publication No.: US10261034B2Publication Date: 2019-04-16
- Inventor: Yoshihiko Shiraishi , Atusi Sakaida , Norio Gouko , Toshihisa Taniguchi , Keiji Okamoto
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya, Aichi-pref.
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya, Aichi-pref.
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2014-114827 20140603; JP2015-099314 20150514
- International Application: PCT/JP2015/002742 WO 20150601
- International Announcement: WO2015/186330 WO 20151210
- Main IPC: G01N25/18
- IPC: G01N25/18 ; G01K17/00 ; H01L35/32 ; H01L35/34

Abstract:
A heat flow distribution measurement device includes a sensor module having one multilayer substrate and a plurality of heat flow sensor portions arranged inside of the multilayer substrate. The multilayer substrate has one surface and another surface opposite to the one surface and includes a plurality of stacked insulating layers each formed of a thermoplastic resin. The heat flow sensor portions are each formed of thermoelectric conversion elements and are thermoelectrically independent. An arithmetic portion arithmetically determines a heat flow distribution based on an electromotive force generated in each of the heat flow sensor portions. The thermoelectric conversion elements are formed in the multilayer substrate and therefore manufactured by the same manufacturing process for manufacturing the multilayer substrate. This can minimize the performance difference between the individual thermoelectric conversion elements and allow the heat flow distribution to be measured with high precision.
Public/Granted literature
- US20170082564A1 HEAT FLOW DISTRIBUTION MEASUREMENT DEVICE Public/Granted day:2017-03-23
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