- 专利标题: Electrically conductive overlay for head-medium contact sensor
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申请号: US15484261申请日: 2017-04-11
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公开(公告)号: US10255937B1公开(公告)日: 2019-04-09
- 发明人: Gary Joseph Kunkel , Jin Fang , Erik J. Hutchinson
- 申请人: Seagate Technology LLC
- 申请人地址: US CA Cupertino
- 专利权人: Seagate Technology LLC
- 当前专利权人: Seagate Technology LLC
- 当前专利权人地址: US CA Cupertino
- 代理机构: Hollingsworth Davis, LLC
- 主分类号: G11B5/60
- IPC分类号: G11B5/60 ; G11B5/48 ; G11B5/00
摘要:
A contact sensor is provided at or near an air bearing surface of a slider and having a temperature coefficient of resistance. The contact sensor is coupled to a lead arrangement comprising a first lead and a second lead. The contact sensor comprises a sensor element, a first peripheral wing comprising an inner wing connected to the sensor element and an outer wing connected to the first lead, and a second peripheral wing comprising an inner wing connected to the sensor element and an outer wing connected to the second lead. An electrically conductive overlay covers at least the outer wings of the first and second peripheral wings and some or all of the first and second electrical leads.
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