- 专利标题: Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages
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申请号: US15966060申请日: 2018-04-30
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公开(公告)号: US10229888B2公开(公告)日: 2019-03-12
- 发明人: Ah Ron Lee , Deog Soon Choi , Young Ho Lee , Boon Keat Tan , Jin Ho Choi
- 申请人: Avago Technologies General IP (Singapore) Pte. Ltd
- 申请人地址: SG Singapore
- 专利权人: Avago Technologies International Sales Pte. Limited
- 当前专利权人: Avago Technologies International Sales Pte. Limited
- 当前专利权人地址: SG Singapore
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/18 ; H05K1/11 ; H01L23/552 ; H01L25/065 ; H01L25/16 ; H01L23/31 ; H01L23/58 ; H01L21/56 ; H01L23/538 ; H01L23/16 ; H01L23/00 ; H01L25/00
摘要:
A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.
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