- 专利标题： Electronic device module and manufacturing method thereof
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申请号： US14676745申请日： 2015-04-01
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公开(公告)号： US10219380B2公开(公告)日： 2019-02-26
- 发明人: Do Jae Yoo , Jae Hyun Lim , Kyu Hwan Oh , Jong In Ryu
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR10-2014-0041668 20140408
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/40 ; H05K1/11 ; H05K3/28 ; H05K3/34
摘要：
An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.
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