- 专利标题： Lid and method for sealing a non-magnetic package
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申请号： US14529410申请日： 2014-10-31
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公开(公告)号： US10196745B2公开(公告)日： 2019-02-05
- 发明人: Christopher Kapusta , Marco Francesco Aimi
- 申请人： General Electric Company
- 申请人地址： US NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： US NY Schenectady
- 代理机构： Ziolkowski Patent Solutions Group, SC
- 代理商 Jean K. Testa
- 主分类号： B23K101/00
- IPC分类号： B23K101/00 ; B23K101/36 ; B23K37/00 ; C23C28/02 ; B81C1/00
摘要：
A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
公开/授权文献
- US20160122183A1 LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE 公开/授权日：2016-05-05
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