- 专利标题： Vertically integrated image sensor chips and methods for forming the same
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申请号： US15845049申请日： 2017-12-18
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公开(公告)号： US10157958B2公开(公告)日： 2018-12-18
- 发明人: Jeng-Shyan Lin , Feng-Chi Hung , Dun-Nian Yaung , Jen-Cheng Liu , Szu-Ying Chen , Wen-De Wang , Tzu-Hsuan Hsu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L27/146
- IPC分类号： H01L27/146
摘要：
A method includes bonding a Backside Illumination (BSI) image sensor chip to a device chip, forming a first via in the BSI image sensor chip to connect to a first integrated circuit device in the BSI image sensor chip, forming a second via penetrating through the BSI image sensor chip to connect to a second integrated circuit device in the device chip, and forming a metal pad to connect the first via to the second via.
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