A series module assembly particularly for drive technology includes a bus system and series modules arranged in side by side in a row on a mounting base. The series modules each have an electronics housing in which at least one electronic element is arranged. The bus system includes busbars that extend outside of the electronics housing, wherein at least one of the busbars can be electrically connected to the electronic element of one of the series modules via a plug assembly. The series module assembly is designed for wall mounting. The bus bars are pre-assembled with a mounting and bus rail and anchored to the wall. The mounting and bus rail is configured so that the series modules can be mounted on the mounting and bus rail in a direction parallel to the wall in order to establish contact with the busbars. The mounting and bus rail can be adjustably mounted at a selected distance from the wall.