- 专利标题: Integrating thin and thick gate dielectric nanosheet transistors on same chip
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申请号: US15815009申请日: 2017-11-16
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公开(公告)号: US10141403B1公开(公告)日: 2018-11-27
- 发明人: Kangguo Cheng , Juntao Li , Geng Wang , Qintao Zhang
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/51 ; H01L21/8234 ; H01L21/84 ; H01L21/306 ; H01L21/311 ; H01L29/423
摘要:
A method is presented for integrating a first nanosheet transistor and a second nanosheet transistor on a chip. The method includes forming a first stack of alternating layers for the first gate dielectric nanosheet transistor and a second stack of alternating layers for the second gate dielectric nanosheet transistor, removing a first set of sacrificial layers of the first stack of alternating layers of the first gate dielectric nanosheet transistor and removing a first set of sacrificial layers of the second stack of alternating layers of the second gate dielectric nanosheet transistor, and removing a second set of sacrificial layers of the first stack of alternating layers. The method further includes annealing a second set of sacrificial layers to subsequently remove the second set of sacrificial layers of the second stack of alternating layers, and forming a first gate dielectric nanosheet transistor and a second gate dielectric nanosheet transistor.
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