- 专利标题： Package substrate, method for fabricating the same, and package device including the package substrate
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申请号： US15926287申请日： 2018-03-20
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公开(公告)号： US10134666B2公开(公告)日： 2018-11-20
- 发明人: Soojae Park , Kyujin Lee
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2016-0001002 20160105
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48 ; H01L23/00
摘要：
A package substrate including an insulating layer having a top surface and a bottom surface opposite to the top surface, at least one first copper pattern disposed in the insulating layer and adjacent to the top surface of the insulating layer, at least one second copper pattern disposed on the bottom surface of the insulating layer, and at least one embedded aluminum pad disposed on the at least one first copper pattern, the at least one embedded aluminum pad disposed in the insulating layer such that a top surface of the at least one embedded aluminum pad is exposed by the insulating layer may be provided.
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