- 专利标题: Multilayer capacitor and board having the same
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申请号: US15407473申请日: 2017-01-17
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公开(公告)号: US10128048B2公开(公告)日: 2018-11-13
- 发明人: Heung Kil Park , Jong Hwan Park
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2016-0049825 20160425
- 主分类号: H01G4/228
- IPC分类号: H01G4/228 ; H01G4/30 ; H05K1/11 ; H05K1/18
摘要:
A multilayer capacitor includes a body including a capacitor body formed by layering a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting surface of the capacitor body and disposed to be spaced apart from each other, respectively; and first, second and third external electrodes disposed on the mounting surface of the capacitor body to be connected to the lead portions, respectively, wherein the first, second and third external electrodes each include first, second and third electrode layers which are sequentially stacked, the first and second electrode layers containing metal and glass particles, and the third electrode layer containing a conductive resin.
公开/授权文献
- US20170309403A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME 公开/授权日:2017-10-26
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