- 专利标题: Attachment structure for electronic component accommodation box
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申请号: US15615381申请日: 2017-06-06
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公开(公告)号: US10122394B2公开(公告)日: 2018-11-06
- 发明人: Naoyuki Ikeda , Toshitaka Iwasaki , Hiroki Kayamori , Takao Murakami
- 申请人: Yazaki Corporation
- 申请人地址: JP Tokyo
- 专利权人: YAZAKI CORPORATION
- 当前专利权人: YAZAKI CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Kenealy Vaidya LLP
- 优先权: JP2016-115225 20160609
- 主分类号: H04B1/06
- IPC分类号: H04B1/06 ; B60R16/023 ; B60R11/00 ; H04B1/08
摘要:
An attachment structure for an electronic component accommodation box including a vibration proof structure includes a damping structure between a vehicle body side attachment member and a casing in which at least one electronic component is mounted. The damping structure includes first sliding portions, second sliding portions, and damping members interposed between the first sliding portions and the second sliding portions. The damping members generate sliding resistance between each of the first sliding portions and each of the second sliding portions when the casing moves relative to the vehicle body side attachment member.
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