Invention Grant
- Patent Title: Multi-turn coil on metal backplate
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Application No.: US14854303Application Date: 2015-09-15
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Publication No.: US10122182B2Publication Date: 2018-11-06
- Inventor: Randy Standke , Chih-Hsiang Ko , Seong Heon Jeong
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Hunter Clark PLLC
- Main IPC: H04M3/24
- IPC: H04M3/24 ; H02J5/00 ; H01F27/28 ; H01F38/14 ; H02J7/00 ; H04B5/00 ; H04M1/02 ; H02J50/12 ; H02J50/27 ; H01F27/36 ; H02J50/80 ; H01Q7/00

Abstract:
Disclosed is a wireless power transfer apparatus that includes a case for an electronic device. The case may have an electrically conductive panel portion and side portions defined along sides of the panel portion. The case further have at least one opening formed one of the side portions. A coil configured to couple to an externally generated magnetic field may have first segments that span a width of the panel portion of the case and second segments arranged along the side portions of the case and exposed through the at least one opening.
Public/Granted literature
- US20160254678A1 MULTI-TURN COIL ON METAL BACKPLATE Public/Granted day:2016-09-01
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