- 专利标题： Molded die slivers with exposed front and back surfaces
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申请号： US15646163申请日： 2017-07-11
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公开(公告)号： US10081186B2公开(公告)日： 2018-09-25
- 发明人: Chien-Hua Chen , Michael W. Cumbie
- 申请人： Hewlett-Packard Development Company, L.P.
- 申请人地址： US TX Houston
- 专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人地址： US TX Houston
- 代理机构： HP Inc. Patent Department
- 主分类号： B41J2/16
- IPC分类号： B41J2/16 ; B41J2/14 ; B41J2/045
摘要：
In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
公开/授权文献
- US20170305158A1 MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES 公开/授权日：2017-10-26
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