- 专利标题： Semiconductor device
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申请号： US13357690申请日： 2012-01-25
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公开(公告)号： US10079226B2公开(公告)日： 2018-09-18
- 发明人: Kuniaki Mamitsu , Takanori Teshima
- 申请人： Kuniaki Mamitsu , Takanori Teshima
- 申请人地址： JP Kariya
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya
- 代理机构： Posz Law Group, PLC
- 优先权： JP2004-327670 20041111
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L25/11 ; H01L23/473 ; H05K7/20 ; H01L23/40
摘要：
A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.
公开/授权文献
- US20120119347A1 SEMICONDUCTOR DEVICE 公开/授权日：2012-05-17
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