Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.