- 专利标题: Molded resin-equipped electric wire and molded resin-equipped electric wire production method
-
申请号: US15740105申请日: 2016-07-01
-
公开(公告)号: US10065342B2公开(公告)日: 2018-09-04
- 发明人: Toshiya Hirooka , Kouji Fukumoto , Daisuke Hashimoto , Jisung Kim , Kenji Miyamoto , Mitsuru Hirose , Hitoshi Horio
- 申请人: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 申请人地址: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- 专利权人: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- 代理机构: Reising Ethington, P.C.
- 优先权: JP2015-138407 20150710
- 国际申请: PCT/JP2016/069577 WO 20160701
- 国际公布: WO2017/010308 WO 20170119
- 主分类号: H01R9/05
- IPC分类号: H01R9/05 ; B29C33/12 ; H01R43/24 ; H01R4/70 ; H01R13/40
摘要:
When forming molded resin on a terminal-equipped conductive wire, cases where resin inside the mold for insert-molding leaks out from the mold are suppressed. A smooth portion having a smooth outer circumferential surface is formed in a conductive wire of a terminal-equipped conductive wire (smooth portion formation step (S2)). Furthermore, a molded resin member that covers the terminal connection portion is formed in a state where the terminal connection portion provided is inserted into an insert-molding mold, and a portion of the conductive wire that extends from a metal terminal is exposed to the outside through an opening portion of the mold (insert-molding step (S3)). The outer shape of the smooth portion is a shape that corresponds to the opening shape of the opening portion of the mold. In the insert-molding step (S3), the interior of the mold is filled with a resin in a state where the inner circumferential surface of the opening portion of the mold is in contact with the outer circumferential surface of the smooth portion.
公开/授权文献
信息查询