- 专利标题： Fabrication method of package having ESD and EMI preventing functions
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申请号： US14817624申请日： 2015-08-04
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公开(公告)号： US10062582B2公开(公告)日： 2018-08-28
- 发明人: Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
- 申请人： Siliconware Precision Industries Co., Ltd.
- 申请人地址： TW Taichung
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW Taichung
- 代理机构： Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权： TW99140955A 20101126
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/552 ; H01L23/00
摘要：
A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.
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