- 专利标题： Embedded layered inductor
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申请号： US14073756申请日： 2013-11-06
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公开(公告)号： US10051741B2公开(公告)日： 2018-08-14
- 发明人: Young Kyu Song , Daeik Daniel Kim , Xiaonan Zhang , Ryan David Lane , Jonghae Kim
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理机构： Muncy, Geissler, Olds & Lowe
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K1/16 ; H05K1/14
摘要：
An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric layer adjacent the patterned metal layer.
公开/授权文献
- US20150124418A1 EMBEDDED LAYERED INDUCTOR 公开/授权日：2015-05-07
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