A method and apparatus for distributing power in an integrated circuit (IC) is disclosed. The IC includes at least one electrically conductive bump coupled to a true voltage node. Power may be distributed to the IC from an external power source coupled to the bump. The integrated circuit further includes a virtual voltage node. A power switch may be implemented, with the power switch being located directly beneath the bump. A first vertical connector may couple one portion of the power switch to the bump, while a second vertical conductor may couple another portion of the switch to the virtual voltage node.