Invention Grant
- Patent Title: LED lamp having integrally injection-molded heat conductive plastic part and loading power substrate, and process thereof
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Application No.: US14997599Application Date: 2016-01-18
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Publication No.: US10030827B2Publication Date: 2018-07-24
- Inventor: Meihua Yu
- Applicant: ZHUHAI SEPSTAR ELECTRONIC CO., LTD.
- Applicant Address: CN Zhuhai
- Assignee: ZHUHAI SEPSTAR ELECTRONIC CO., LTD.
- Current Assignee: ZHUHAI SEPSTAR ELECTRONIC CO., LTD.
- Current Assignee Address: CN Zhuhai
- Priority: CN201511008330 20151225
- Main IPC: F21V1/00
- IPC: F21V1/00 ; F21K9/90 ; F21K99/00 ; F21V29/85 ; F21S8/02

Abstract:
The present invention relates to an LED lamp having an integrally injection-molded heat conductive plastic part and loading power substrate, comprising a lamp shell and LED modules, the lamp shell being injection-molded from heat conductive plastic material, the LED modules which are connected by injection being provided in the lamp shell; and each of the LED modules comprises an aluminum substrate and a power circuit module, and LED beads are provided on the aluminum substrate and in ON-connection with the power circuit module. Since the LED modules have been connected by injection during the injection of the lamp shell of the LED lamp of the present invention, this may greatly simplify the subsequent assembly processes, significantly improve the production efficiency and obviously reduce the number of operators for assembling.
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