- 专利标题： Headphone assembly with interchangeable earpiece module
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申请号： US15399288申请日： 2017-01-05
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公开(公告)号： US10015580B1公开(公告)日： 2018-07-03
- 发明人: Joseph R. Bruno
- 申请人： Joseph R. Bruno
- 代理机构： Husch Blackwell LLP
- 主分类号： H04R1/10
- IPC分类号： H04R1/10 ; H04R5/033
摘要：
The present invention is a headphone assembly comprising a headband for fitting around the head of the user, a first earpiece module detachably connected to the first end of the headband, and a second earpiece module detachably connected to the second end of the headband.
公开/授权文献
- US20180192180A1 HEADPHONE ASSEMBLY WITH INTERCHANGEABLE EARPIECE MODULE 公开/授权日：2018-07-05
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