- 专利标题： Method of manufacturing pattern substrate and method of locating component
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申请号： US14295753申请日： 2014-06-04
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公开(公告)号： US10005663B2公开(公告)日： 2018-06-26
- 发明人: Naoki Yamamoto , Kanji Nakayama , Keita Saito , Dai Suwama
- 申请人： Konica Minolta, Inc.
- 申请人地址： JP Tokyo
- 专利权人： KONICA MINOLTA, INC.
- 当前专利权人： KONICA MINOLTA, INC.
- 当前专利权人地址： JP Tokyo
- 代理机构： Lucas & Mercanti, LLP
- 优先权： JP2013-121395 20130610
- 主分类号： G03G15/20
- IPC分类号： G03G15/20 ; B81C3/00
摘要：
There is provided a method of manufacturing a pattern substrate in which a pattern is formed on the surface of the substrate. The manufacturing method includes a step of preparing the substrate and a step of arranging a liquid-repellent or lyophilic material on the surface of the substrate so as to form the pattern on the surface of the substrate in which the surface of the substrate has a liquid-repellent region and a lyophilic region, the pattern is formed by one of the liquid-repellent region and the lyophilic region and the pattern is used to locate a component by the surface tension of a liquid member.
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