The utility model discloses a compound packing structure. The compound packing structure comprises a protecting basal body and a buffer layer between the surface of the protecting basal body, which goes towards the inner wall of an external packing case of a rectangle, and the inner wall of the external packing case of the rectangle. The utility model has the advantages of that the compound packing structure has the characteristic of traditional foam which has a high gluing degree with the appearances of products, the lower cost, may realize a shaping by extruding, and has a quicker manufacturing of multitudinous products, and also has the advantages of that the shock absorption foam has a safety factor higher than traditional forms, thereby markedly enhancing the buffering and shock absorption effect of products, promoting the unpacking pass percent of products greatly and lowering the repair cost of products only with a slight rise of manufacturing cost of the packing structure. The adoption of the compound packing structure realizes a qualified packing in time without raising cost to make foam packing die in a bid, thereby satisfying the requirements of customers. The utility model may be widely applied to the packing of products concerning electronic information, hardware, electromotor, precise instruments and meters.