The utility model discloses a copper electroplating device for a circuit board. The copper electroplating device comprises a tank body, titanium baskets, a floating target, a filtering machine water absorbing box, an inflating pipe, a spray pipe, an inflating pump and a filtering machine, wherein the titanium baskets are arranged on two opposite side walls of the tank body and are used for accommodating anode materials; the floating target is used for fixing a cathode material; the filtering machine water absorbing box, the pumping pipe and the spray pipe are arranged at the bottom of the tank body; the inflating pump and the filtering machine are arranged outside the tank body; the filtering machine water absorbing box and the inflating pipe are respectively connected with the filtering machine; and the inflating pipe is connected with the inflating pump. The copper electroplating device disclosed by the utility model has the beneficial effects that firstly, the filtering machine water absorbing box, the pumping pipe and the spray pipe are arranged at the bottom of the tank body, and thus the circulation of liquid medicine of a copper electroplating tank is enhanced, the turbulence flow is formed and the problems of fineness, high possibility of clamping film for independent circuits and non-uniformity of copper electroplating due to poor uniformity of copper electroplating in the application of the general vertical copper electroplating production process are solved; secondly, the bottom of the floating target is changed into a semicircular base, and micro holes are formed in the base and are convenient for leakage of the liquid medicine during the lifting of a skeet, and thus the circulating effect is enhanced; and thirdly, the copper electroplating device is concise in structure, low in production cost and easy for large-scale production.