An improved printed wiring board (PWB) composite stamping die comprises an upper die part and a lower die part, wherein, a ring ribbon-shaped main shearing supporting surface with certain width is reserved on the edge of a male mold, a ring ribbon-shaped sub-shearing supporting surface with certain width surrounds each reserved hole, a cavity is formed on the rest part thereof, and the surface of the mixed glue filled in the cavity is slightly lower than the surface of the male mold; and the ring ribbon-shaped main shearing supporting surface with certain width is reserved on the edge of a stripper plate, the ring ribbon-shaped sub-shearing supporting surface with certain width is reserved around the through hole of each punch needle, an accommodating cavity is formed on the rest part thereof, and the surface of the mixed glue filled in the accommodating cavity is slightly lower than the surface of the stripper plate. When in punching, the non-copper foil shearing part at the edge of the base material of a circuit board and the non-copper foil part at the periphery of each hole to be punched on the base material of the circuit board are compacted between the shearing supporting surfaces of the male mold and the stripper plate, thereby effectively solving the problem of crack and scrap of plate edges and hole edges because the stressed part in a conventional stamping die such as a circuit board base material, an edge and the like are hung in the air.