Provided is a method of manufacturing a circuit board with which double-sided conductive metal layers are surely conducted in a double-sided circuit board and further, a cross-sectional shape of circuit wiring is not made worse. In a method of manufacturing a circuit board including a conduction structure formed from a through-hole or a bottomed via-hole, a conductive material is given by forminga conduction hole on a double-sided metal-clad laminate including conductive metal layers on both sides of an insulating base, a plating resist film 9 is formed excepting for said conduction hole anda land thereof, the plating resist film is released and removed after conducting the conductive metal layers and forming a circuit wiring pattern by plating, and the circuit wiring pattern is formed by removing the exposed conductive metal layers and electrically separating the circuit wiring pattern. The step of forming a plating layer for conduction between the double-coated conductive layers and the step of forming a plating layer for circuit wiring formation are performed separately from each other.