The invention aims at improving the temperature resisting cycle characteristics after mounting and moisture absorption resiting reflow characteristics of a chip-mounted semiconductor, and provides anadhesive which functions as a bonding member to be used when a semiconductor chip is mounted on an organic supporting substrate and which has storage moduli at 25 DEG C and at 260 DEG C as measured with a dynamic visco-elasticity measuring instrument of 10-2000 MPa and 3-50 MPa, respectively, a double-coated adhesive film produced therewith, a semiconductor device, an semiconductor chip mounting substrate, and methods of manufacturing these products.