The present invention relates to an impedance transformation circuit (10; 11 a; 11 b; 12) with a first contact pad (51) and a second contact pad (52) being spaced-apart and formed on a substrate (20). The impedance transformation circuit comprises at least first circuit element (40) providing a contact area (41) formed on the substrate (20) which is arranged adjacent and between the first (51) and the second (52) contact pad. A first 'Wire element (31) extends over the substrate (20) connecting the first contact pad (51) and a first end portion (41 a) of the contact area of the first circuit element (40), whilst at least a second wire element (32) extends over the substrate (20) connecting the second contact pad (52) and a second end portion (41b) of the contact area of the first circuit element (40). The contact area of the first circuit element (40) is shaped such that it is provided a capacitive connection with a predetermined capacitance between the contact area and a fixed reference poteitial. The packing density of the whole circuit can advantageously be increased by having tibe first wire element (31) and the at least second wire element (32) the same shape and having them arranged substantially in parallel to each other and further, by having the first contact's pad (51) and the second contact pad (52) located at opposite sides of the contact area of the at least firstcircuit element (40). Multiple impedance transformation circuits according to the invention can advantageously combined to a multi-coupled wire impedance transformation circuit (12).