Silica-based materials and films having a dielectric constant of 3.7 or below and compositions and methods for making and using same are disclosed herein. In one aspect, there is provided a composition for preparing a silica-based material comprising an at least one silica source, a solvent, an at least one porogen, optionally a catalyst, and optionally a flow additive wherein the solvent boils at a temperature ranging from 90 DEG C. to 170 DEG C. and is selected from the group of compounds represented by the following formulas: HO-CHR⁸-CHR⁹-CH₂-CHR¹⁰R¹¹ where R⁸, R⁹, R¹⁰ and R¹¹ can independently be an alkyl group ranging from 1 to 4 carbon atoms or a hydrogen atom; and R¹²-CO-R¹³ where R¹² is a hydrocarbon group having from 3 to 6 carbon atoms; R¹³ is a hydrocarbon group having from 1 to 3 carbon atoms; and mixtures thereof.