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CN1680172A 用于将塑料薄片施加于基片材料的密封单元 失效 - 权利终止

用于将塑料薄片施加于基片材料的密封单元
摘要：
本发明涉及通过使用带有工作表面的密封板和可相对其运动的背板、借助于热量和压力将塑料薄膜施加于平面的基片材料的密封单元，其中密封单元连接于带有模切刀和对面板的模切单元，该冲切单元用于随后在平面基片材料中施加塑料薄膜的区域内的所选位置处进行冲切。为了改进现有技术的密封单元，以使模切边缘不再有载体材料或塑料形成的破碎脱落的碎屑，而是整齐的和没有凸起，按照本发明，密封单元的密封板在面向背板的其工作表面上具有突出区域和凹入区域，并且密封板内的凹入区域的位置对应于模切刀的位置，从而在基片材料内的所选位置处进行切割，且因为密封板的凹入区域，所以在所述位置处几乎没有对基片材料和它的叠层加热。
摘要（英）：

A sealing unit (8) comprises a sealing plate (11) with heated active surface and back plate (9), die cutting unit (16) with die cutting knife (15), and counter plate for making die cuts at selected locations in the planar substrate material in the region of the applied plastic foil. The sealing plate has set(s) of raised and depressed regions on its active surface. A sealing unit comprises a sealing plate with heated active surface and back plate, die cutting unit with die cutting knife, and counter plate for making die cuts at selected locations in the planar substrate material (1) in the region of the applied plastic foil (7). The sealing plate generates heat and pressure to the substrate material during the sealing process. It has set(s) of raised regions (14) and depressed regions (13) on its active surface facing the back plate and the location of the depressed regions in the sealing plate corresponds to the location of the die cutting knife, so that cut is made at the selected positions in the substrate material where, because of the depressed regions of the sealing plate, there is reduced heating of the substrate material and associated laminations.

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